Hardware Engineer Advanced PCB & Enclosure Design

Casabot

Role Overview

We are seeking a Hardware Engineer with deep expertise
in advanced PCB design and enclosure design for IoT and
edge-computing devices. You will drive the design and development of
CASABOTu2019s hardware platforms, enabling high-performance, secure, and
reliable integrations across diverse architectures. From concept to
prototype to production, youu2019ll ensure CASABOT devices are built to
global standards of performance, scalability, and elegance.

Key Responsibilities

• Design, simulate,
  and optimize multi-layer PCBs
  for ARM, x86,
  and NVIDIA-based platforms.
  

• Develop RF and antenna layouts
  supporting
  Zigbee, BLE, Wi-Fi, and multi-protocol connectivity.
  

• Lead enclosure design
  (plastics,
  metals, composites) balancing aesthetics, durability, thermal
  management, and cost efficiency.
  

• Collaborate with
  firmware, AI, and product design teams to align hardware
  with system requirements.
  

• Oversee prototyping, testing, and
  validation u2014 ensuring
  compliance with CE, FCC, and global certifications.
  

• Interface with suppliers,
  manufacturers, and partners to take designs from prototype to mass production
  .
  

• Document designs, processes, and
  compliance for internal IP and external certifications.
  

  
  

  
  
  Requirements
  

  • Bacheloru2019s or
    Masteru2019s in Electrical/Electronics
    Engineering or related
    field.
    
  • 
    
  • 5+ years experience in PCB design, layout, and enclosure
    design for IoT or
    edge computing devices.
    

    • Strong knowledge
      of ARM, x86, NVIDIA Jetson
      or equivalent
      platforms.
      

    • Hands-on expertise in Zigbee, BLE, Wi-Fi, and multi-radio architectures
      .
      

    • Proficiency
      with EDA tools
      (Altium
      Designer, KiCAD, Cadence, or similar).
      

    • Solid
      background in mechanical design software
      (SolidWorks,
      AutoDesk Inventor, etc.).
      

    • Experience in thermal, EMI/EMC, and RF considerations .
      

    • Track record of taking hardware from concept through certification to production
      
      

    • Strong
      problem-solving, cross-disciplinary collaboration, and
      documentation skills.